Digital, Time Domain, & OEIC Subcommittee
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Y. K. Chen Bell laboratories, Alcatel-Lucent e-mail:
Subcommittee Chair
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Kimikazu Sano, NTT Photonics Laboratories 3-1 Morinosato Wakamiya, Atsugi, Kanagawa, 243-0198 Japan
E-mail:
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Timothy (Tod) Dickson IBM T.J. Watson Research Center 1101 Kitchawan Road MS 36-145 Yorktown Heights, NY 10598
Email:
Concurrent
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Matt D’Amore Northrop Grumman 1 Space Park Blvd. Redondo Beach, CA 90278
Email:
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Erik Daniel Mayo Foundation 200 First Street SW Rochester, MN 55905 E-mail:
Web: www.mayo.edu/sppdg/
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Douglas McPherson ITT A/CD 710-411 Legget Drive Kanata, Ontario K2K 3C9 CANADA Email:
Executive Committee Secretary
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Sorin Voinigescu University of Toronto Dept. Electrical @ Computer Engineering 10 King’s College Road Toronto, ON, Canada M5S3G4 E-mail:
Concurrent Executive Committee Publicity |
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Analog, RF, & Microwave Subcommittee
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Peter Zampardi SkyWorks Solutions, Inc
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Peter Katzin Hittite Microwave Corporation 20 Alpha Road Chelmsford, MA 01824 E-mail: [email protected]
Subcommittee Chair
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Harris (Chip) Moyer HRL Laboratories 3011 Malibu Canyon Road, Malibu, CA 90265 E-mail:
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Matthew Poulton RF Micro Devices 10420A Harris Oaks Boulevard Charlotte, NC 28269 e-mail:
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Liang-Hung Lu Dept. of Electrical Engineering National Taiwan University No. 1, Sec. 4, Roosevelt Rd., Taipei, Taiwan Email:
Concurrent
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Dr. Michael Schlechtweg
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Robb Shimon Agilent Technologies, Inc. Santa Rosa Tech Center Fab 1400 Fountaingrove Parkway MS 1LS-K Santa Rosa, CA 95403
E-mail:
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Kazuya Yamamoto Mitsubishi Electric Corporation 4-1 Mizuhara, Itami, Hyogo 664-8641, Japan E-mail:
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Dan Scherrer Northrop Grumman M5/2154F, One Space Park Redondo Beach, CA 90278 E-mail:
Executive Committee Treasurer |
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Raytheon RF Components 362 Lowell Street Andover, MA 01810 E-mail:
Executive Committee Publications
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Jan-Erik Mueller Infineon Technologies Communication Solutions COM PS CE RF Am Campeon 1-12 D-85579 Neubiberg Germany E-mail:
Overseas Advisor |
Chul Soon Park
Overseas Advisor
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Huei Wang
Concurrent Overseas Advisor |
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Technology and Manufacturing Subcommittee
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Mike Golio HVVi Semiconductor 2458 East Kael Circle Mesa, AZ 85213 Tel: 480-615-6990 Email:
Concurrent Subcommittee Chair
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Martin Dvorak Agilent Technologies, Inc. High Frequency Tech Center 1400 Fountaingrove Parkway MS 1LS-J Santa Rosa, CA 95403
E-mail:
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Robert J. Trew North Carolina State University
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Ming-Yih Kao TriQuint Semiconductor 500 W. Renner Road Richardson, TX 75080
Email:
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Dylan Kelly Peregrine Semiconductor Email:
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Jean Olivier Plouchart IBM SRDC 2070 Route 52 Hopewell Junction, NY 12533 Email:
Concurrent
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Open |
Dave Halchin Corporate R&D RF Micro Devices 7628 Thorndike Rd. Greensboro, NC 27409 USA E-mail:
Executive Committee Technical Program Vice Chair |
Walter A. Wohlmuth RF Micro Devices 7628 Thorndike Road, Greensboro, NC 27409 Email :
Executive Committee Local Arrangements Chair |
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Marc Rocchi OMMIC 2 Chemin du Moulin Limeil Brevannes Cx, 94453 France E-mail:
Overseas Advisor |
Toshihide Kikkawa Fujitsu Laboratories Ltd. Atsugi, 243-0197, Japan E-mail :
Overseas Advisor |
Freek van Straten NXP Semiconductors Gerstweg 2 6534 AE Nijmegen, Netherlands E-mail:
Overseas Advisor |
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Jean Olivier Plouchart IBM SRDC 2070 Route 52 Hopewell Junction, NY 12533 Email:
Subcommittee Chair
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Timothy (Tod) Dickson IBM T.J. Watson Research Center 1101 Kitchawan Road MS 36-145 Yorktown Heights, NY 10598
Email:
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Mike Golio HVVi Semiconductor 2458 East Kael Circle Mesa, AZ 85213
Email:
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Liang-Hung Lu Electrical Engineering Dept, National Taiwan University No. 1, Sec. 4, Roosevelt Rd., Taipei, Taiwan Email:
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Kazuya Yamamoto Mitsubishi Electric Corporation 4-1 Mizuhara, Itami, Hyogo 664-8641, Japan E-mail:
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Huei Wang
Overseas Advisor |
Sorin Voinigescu University of Toronto Dept. Electrical @ Computer Engineering 10 King’s College Road Toronto, ON, Canada M5S3G4 Email:
Executive Committee Publicity
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