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2012 IEEE Compound
Semiconductor IC Symposium
October 14-17 at the Hyatt Regency Hotel
La Jolla, California
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2012 Abstract Schedule |
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Author Notification: June 30, 2012 |
Extended Abstracts Due: Aug 1, 2012 |
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General Information |
Author Information |
Attendee Information |
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· 2012 Abstract Template (Word 97) · 2012 Abstract Template (Word 2007 zip) · 2012 Abstract Template (pdf)
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· Travel · Hotel · On-Line Symposium Registration · Symposium Registration – hard copy form
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| 2012 Silver Sponsors |
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| We are now accepting exhibitor and sponsor registrations | ||||||||
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| This web site was last updated on May 11, 2012 | ||||||||
Symposium Registration Information:
On-line symposium
registration will be available soon
ACCOMMODATIONS: The symposium hotel is the Hyatt Regency Hotel, La Jolla, California, USA
Please use the following link for reservations CSICS Hotel Reservations
Hotel Information:
Previous Papers, Proceedings and CD's
Hardcopy Proceedings, reprints and/or CD's of previous years symposium are available for purchase through the IEEE. Please contact
| IEEE Customer Service Ph: +1 800 678 4333 or +1 732 981 0060 Email: customer.service@ieee.org |
The IEEE Compound Semiconductor IC Symposium (CSICS) Exhibition will bring together experts in compound semiconductor ICs as well as high speed silicon and other advanced technology ICs. The CSICS plenary session, held in the morning prior to the exhibition opening, will feature international speakers as well as speakers from industry leaders. The CSICS Exhibition features vendors offering various products and services including:
Below is some additional information about the schedule, exhibitor list, floor plan of the 2012 Exhibition as well as the contract
Sponsors: Corporate Benefactor Opportunities are open for the
2012 IEEE Compound Semiconductor IC Symposium
Please send us a message below requesting more information
Contact Information:Please e-mail your Questions and/or comments about the IEEE Compound Semiconductor IC Symposium or this web site with the feedback message link below.