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Important Info

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Gold
Silver
Silver
Media Partners and Other IEEE Conferences
Media Partners and Other IEEE Conferences
Media Partners and Other IEEE Conferences
Media Partners and Other IEEE Conferences
Media Partners and Other IEEE Conferences
Exhibiting Company - Booth 210
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2017 High-Speed Digital, Mixed Signal, & Optoelectronics ICs

Yurly Greshishchev
Ciena Corporation

Subcommittee Chair

Cheng Li 
HP Labs
TPC member
Craig Steinbeiser
Qorvo

Publication Chair

Delong Cui
Broadcom

TPC Member

Hui Pan
Broadcom Corporation
TPC member
James Buckwalter
University of California Santa Barbara

Academic Advisor

Kumar Lakshmikumar
Cisco Systems

TPC member

Maarten Tytgat
Nokia – Bell Labs
TPC Member
Mark Webster
Cisco Systems

TPC member

Munehiko Nagatani 
NTT Photonics Laboratories, NTT Corporation

TPC member

Shahriar Shahramian
Nokia – Bell Labs

TPC member

Thé Linh Nguyen 
Finisar Corporation
Treasurer
Thomas Toifl
IBM Zurich Research Laboratory

TPC member

Waleed Khalil
The Ohio State University

Academic Advisor